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BRAND

PLACE OF ORIGIN

MODEL

THICKNESS

HEAT RESISTANCE TEMPERATURE

APPLICATION

Futurrex

U.S.A

PR1-500A

0.4μm~0.9μm

Heat resistance temperature =110 ℃

Wet etching, reactive ion beam etching, ion implantation, electroplating

PR1-1000A

0.7μm~2.0μm

PR1-1500A

1.3μm~3.0μm

PR1-2000A

1.7μm~4.0μm

PR1-4000A

3.7μm~10.0μm

PR1-12000A

10.0μm~25.0μm

Micro Resist

Germany

ma-P 1200series

0.5~50μmThickness of glue

It is very suitable for etching mask, excellent anti drying and wet etching properties.
Excellent electroplating properties (extremely high stability in acid and alkaline bath).
The thermal stability of the photoresist pattern is good; it develops under alkaline aqueous solution.
Broadband, G, or I line exposure