UV negative photoresist - wet process    


BRAND

PLACE OF ORIGIN

MODEL

EXPOSURE

APPLICATION

FEATURES

IMPACT ON PRODUCTION

Futurrex

U.S.A

NP9–250P

Viscosity enhanced negative adhesive series for I line exposure

Instead of polyisoprene diazide (Polyioprene-Bisazide) negative adhesive in design and manufacture.

Super adhesive force in wet etching and electroplating; it is easy to remove with glue. The thickness range of the single spin coating is as follows:
< 0.1 to 200 m can be exposed at I, G and H-line wavelengths.

The advantages of developing and rinsing based on organic solvents are superior to those of traditional positive glue: the straight side wall can be obtained by the excellent line width and arbitrary thickness of the surface.
200 mu m thickness can be obtained by single spin coating
Thick glue can also get superior resolution
The application of soft baking at 150 centigrade can shorten the baking time
Excellent photoreceptor and increase exposure flux
Faster development. The development of 100 m photoresist takes only 6~8 minutes. There will be no bubbles when the photoresist is exposed.
A developer can be applied to negative glue and positive glue simultaneously.
No need to use tackifier, such as HMDS

NP9–1000P

NP9–1500P

NP9–3000P

NP9–6000P

NP9–8000

NP9–8000P

NP9–20000P

NP9G–250P

Viscosity enhanced negative adhesive series for G and H line exposure

NP9G–1000P

NP9G–1500P

NP9G–3000P

NP9G–6000P

NP9G–8000

Micro 

Resist

Germany

ma-N 400

Broadband or I line exposure

The thickness of mu m glue is 0.5 ~ 20

It is very suitable for use as an etching mask, excellent anti drying and wet etching properties.
PVD and lift-off processing capacity for pattern transfer; excellent electroplating properties (high stability in acid and alkaline bath); good thermal stability of photoresist patterns; development in alkaline aqueous solution;

BRAND

PLACE OF ORIGIN

MODEL

SHEDDING RANGE

APPLICATION

GES

Switzerland

GM1010

0.2 - 0.8 μm

Can be used for spray and spray

GM1040

0.8 - 10 µm

Can be used for spray, spray and inkjet printing

GM1050

3 - 8 µm

Can be used for spray and inkjet printing

GM1060

10 - 50 µm

Can be used for spray and inkjet printing

GM1070

50 - 250 µm

Can be used for spray and inkjet printing

GM1075

250 - 350 µm

Can be used for spray and inkjet printing


UV negative photoresist drying process


BRAND

PLACE OF ORIGIN

MODEL

EXPOSURE

APPLICATION

FEATURES

IMPACT ON PRODUCTION

Futurrex

U.S.A

NR71-250P

Viscosity enhanced negative adhesive series for I line exposure

Instead of polyisoprene diazide (Polyioprene-Bisazide) negative adhesive in design and manufacture.

Super adhesive force in wet etching and electroplating; it is easy to remove with glue. The thickness range of single spin coating is as follows: < 0.1 to 200 m, and can be exposed at I, G and H-line wavelength.

The advantages of developing and rinsing based on organic solvents are superior to those of traditional positive glue: the straight side wall can be obtained by the excellent line width and arbitrary thickness of the surface.
200 mu m thickness can be obtained by single spin coating
Thick glue can also get superior resolution
The application of soft baking at 150 centigrade can shorten the baking time
Excellent photoreceptor and increase exposure flux
Faster development. The development of 100 m photoresist takes only 6~8 minutes. There will be no bubbles when the photoresist is exposed.
A developer can be applied to negative glue and positive glue simultaneously.
No need to use tackifier, such as HMDS

NR71-350P

NR71-1000P

NR71-1500P

NR71-3000P

NR71-6000P

NR5-8000

NR71G-250P

Viscosity enhanced negative adhesive series for G and H line exposure

NR71G-350P

NR71G-1000P

NR71G-1500P

NR71G-3000P

NR71G-6000P

NR5G-8000

Micro 

Resist

Germany

ma-N1400

Broadband or I line exposure

0.5 ~ 20 μm Thickness of glue

It is very suitable for etching mask, excellent resistance to dry and wet engraving; excellent use of PVD and lift-off to process pattern transfer ability; excellent electroplating properties (high stability in acid and alkaline bath); good thermal stability of photoresist pattern; development in alkaline aqueous solution;


UV negative photoresist - lift-of process


BRAND

PLACE OF ORIGIN

MODEL

THICKNESS


EXPOSURE

APPLICATION

MACHINING

FEATURES

Futurrex

U.S.A

NR71-1000PY

0.7μm~2.1μm

High temperature tolerance

Negative adhesive for I line exposure

LEDOLED, display, MEMS, packaging, biochips, etc.

Patterning of metal and dielectric, without the use of the permanent composition of the RIE processing device (the interval of the OLED display), the interconnect, and the air connection microchannel

Form the inverted trapezoidal structure of photoresist when developing
Thickness range: 0.5 ~ 20 mu m
Effect of i, g and h-ray exposure wavelength exposure on production efficiency: metal and dielectric patterning eliminates the need for dry etching without double-layer glue technology

NR71-1500PY

1.3μm~3.1μm

NR71-3000PY

2.8μm~6.3μm

NR71-6000PY

5.7μm~12.2μm

NR9-100PY

0.7μm~2.1μm

Viscosity enhancement

NR9-1500PY

1.3μm~3.1μm

NR9-3000PY

2.8μm~6.3μm

NR9-6000PY

5.7μm~12.2μm

NR71G-1000PY

0.7μm~2.1μm

High temperature tolerance

Sensitivity of negative glue to wavelength of G and H lines

NR71G-1500PY

1.3μm~3.1μm

NR71G-3000PY

2.8μm~6.3μm

NR71G-6000PY

5.7μm~12.2μm

NR9G-100PY

0.7μm~2.1μm

Viscosity enhancement

NR9G-1500PY

1.3μm~3.1μm

NR9G-3000PY

2.8μm~6.3μm

NR9G-6000PY

5.7μm~12.2μm

Micro 

Resist

Germany

ma-N 400

Broadband or I line exposure

0.5~20μm Thickness of glue

It is very suitable for etching mask, excellent resistance to dry and wet engraving; excellent use of PVD and lift-off to process pattern transfer ability; excellent electroplating properties (high stability in acid and alkaline bath); good thermal stability of photoresist pattern; development in alkaline aqueous solution;

ma-N 1400

BRAND

PLACE OF ORIGIN

MODEL

SHEDDING RANGE

APPLICATION

GES

Switzerland

GM1010

0.2 - 0.8 μm

Can be used for spray and spray

GM1040

0.8 - 10 µm

Can be used for spray, spray and inkjet printing

GM1050

3 - 8 µm

Can be used for spray and inkjet printing

GM1060

10 - 50 µm

Can be used for spray and inkjet printing

GM1070

50 - 250 µm

Can be used for spray and inkjet printing

GM1075

250 - 350 µm

Can be used for spray and inkjet printing


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商品信息

  • 商品名称:

    UV negative photoresist - wet process
  • 商品编号:

    ECS000024
  • 上架时间:

    2018-07-07
  • 商品重量:

    0克
  • 商品库存:

    1
Price:$0 Stock:0 piece

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